
Dewey Wu General Manager & senior mechanical engineer at EPOC CRAFTER, 15 years in design engineering, quality, and metallurgy. Hands-on across CNC machining, metalwork, sheet metal, and prototyping (subtractive + 3D printing).
Choosing overmolding materials starts with the bond between the rigid substrate and the softer outer layer. TPE, TPU, TPV, and silicone rubber can provide grip, cushioning, impact protection, or sealing features, but they do not bond equally well to every plastic or metal.
A material pair that works in one product may fail in another. The result depends on the exact resin grades, surface condition, molding temperatures, part geometry, and service environment. Mechanical interlocks can help retain the overmold when chemical adhesion is weak, but they do not automatically prevent edge peeling or separation under repeated loading.
For plastic overmolding, the practical approach is to select the substrate and overmold together, confirm grade-specific compatibility, design the interface, and test representative parts before production. Shore hardness, adhesion tests, and compression set measurements answer different questions. None can establish complete part reliability on its own.
The material selection table and test matrix below separate potential compatibility from verified retention.
1. What Are Overmolding Materials?
Overmolding materials are the polymers, elastomers, or other materials used to form an additional layer over a previously manufactured substrate. The process combines two materials in one component, allowing each to perform a different function.
A rigid substrate typically provides dimensional stability, structural support, and attachment features. The overmold adds properties such as grip, surface compliance, cushioning, vibration damping, or localized protection.
Common rigid substrates include polypropylene (PP), acrylonitrile butadiene styrene (ABS), polycarbonate (PC), and polyamide (PA). Depending on the application, the softer layer may be a thermoplastic elastomer (TPE), thermoplastic polyurethane (TPU), thermoplastic vulcanizate (TPV), or silicone rubber.
These are material families rather than interchangeable specifications. Commercial grades differ in flow, durability and adhesion. The injection molding materials guide covers the structural and thermal properties of the rigid resins.
Overmolding should also be distinguished from simply placing a rubber sleeve over a plastic part. In an overmolded component, the second material is formed directly against the substrate during molding. Retention may come from chemical adhesion, mechanical interlocks, or a combination of both.
Specify the exact grades, interface geometry, process conditions and retention criteria before releasing the tooling.
2. Common Overmolding Materials
TPEs and silicone rubbers are common choices for soft grips, protective surfaces, and flexible features. The correct material depends on the substrate, required hardness, temperature exposure, chemical contact, and how the two materials will be joined.
ISO 18064:2022 identifies several thermoplastic elastomer families, including TPA, TPC, TPO, TPS, TPU, TPV, and TPZ. These classifications help identify polymer chemistry. They do not establish that a particular elastomer will bond to ABS, PC, PP, PA, or another substrate.
2.1 TPE vs TPU for Overmolding
The term TPE covers multiple families of thermoplastic elastomers. TPU is one of those families, so TPE and TPU are not entirely separate material categories.
Styrenic TPEs are frequently considered for soft-touch grips and consumer-facing components. Their actual bonding behavior depends on formulation, including whether the grade was developed for a particular rigid substrate.
TPU materials are often selected where abrasion resistance, flexibility, and mechanical durability matter. However, polyester-based, polyether-based, and polycarbonate-based TPU formulations do not necessarily have the same hydrolysis resistance, chemical resistance, or substrate adhesion.
Specify the substrate and the required wear, moisture and chemical performance before comparing grades.
| Selection factor | Styrenic TPE (TPS) | TPU |
| Material identity | Styrenic thermoplastic elastomer family | Thermoplastic polyurethane elastomer family |
| Common applications | Soft grips, flexible covers, cushioning | Wear-resistant grips, flexible protective parts |
| Hardness selection | Compound grade and specified Shore scale | Grade and specified Shore scale |
| Substrate bonding | Requires compatible formulation | Requires grade-specific assessment |
| Processing | Depends on compound and molding method | Depends on chemistry, moisture and molding method |
| Main concern | Interface retention and service conditions | Mechanical properties, moisture and adhesion |
A lower Shore A value does not automatically produce better grip. The actual response also depends on surface texture, overmold thickness, underlying substrate stiffness, and contact conditions.
For a purchasing specification, identify the commercial grade and hardness scale rather than requesting only “soft TPE” or “60 Shore rubber.”
2.2 Silicone, LSR and Rubber Overmolding
Silicone overmolding is considered for applications requiring elastomeric behavior under demanding thermal or environmental conditions. Liquid silicone rubber (LSR) can be molded onto selected substrates, but its processing route and curing behavior differ from conventional thermoplastic TPE overmolding.
LSR generally involves a reactive curing process. Thermoplastic elastomers are processed through heating, flow, and cooling without the same conventional silicone vulcanization route.
LSR cure temperature and substrate compatibility may require different tooling and adhesion treatment.
Silicone does not automatically bond to an untreated plastic substrate. A specific self-bonding grade, surface treatment, primer, or mechanical retention system may be necessary, depending on the material combination.
For rubber overmolding, the choice between thermoplastic elastomers and cured elastomers should be made before finalizing the mold design. Changing between these material systems later can require substantial changes to tooling, processing, and validation.
3. Substrate and Overmold Compatibility

A polymer materials and properties comparison helps screen substrate stiffness and thermal requirements. For overmolding material compatibility, the resin pair is only a candidate until the grade, surface preparation and forming conditions are fixed.
| Rigid substrate | Overmold candidate | Primary engineering concern | Qualification action |
| PP | PP-compatible TPO, TPV or formulated TPS | Low surface energy; generic TPU may not adhere | Check exact grade pairing and edge retention |
| ABS | ABS-bonding TPE or specified TPU | Grade additives, contamination and molding temperature | Test representative interface |
| PC | PC-bonding TPS or TPU grade | Moisture, residual stress and local heat history | Inspect cracking, peeling and mechanical locks |
| PA | PA-compatible TPE or selected TPU | Moisture uptake and conditioning | Control drying and service exposure |
| Metal | Specified elastomer with primer or interlock | Surface preparation, primer durability and differential expansion | Validate actual finish and exposure |
| LSR substrate pairing | Self-bonding LSR system designed for selected substrate | Cure temperature and adhesion chemistry | Qualify specialized molding process |
Each pairing in the matrix is a screening option, not a guaranteed bond. Qualify the exact grades with a repeatable interface test.
3.1 TPE on PP, ABS, PC and TPU on ABS
For TPE overmolding on PP, begin with an overmold formulated for polypropylene. A resin family label alone cannot establish bonding, particularly where peel force acts at a free edge. For TPE overmolding on ABS or PC, confirm the intended substrate grade and whether the supplier identifies that exact resin chemistry in its guidance. TPU overmolding on ABS likewise needs a grade-specific assessment rather than a blanket compatibility claim.
Production case: industrial handheld instrument grip. The supplied project describes an unreinforced Covestro Makrolon 2405 PC enclosure and a proposed PC-bonding TPE-S grade from the KRAIBURG TPE THERMOLAST K family. The exact soft grade is not specified. The component has two 50 × 20 mm grip zones, yielding 2,000 mm² of planar projected coverage; actual curved contact area is a separate geometric quantity. The application is intermittent indoor and outdoor use with a specified environmental envelope of −10 to 50 °C and 20% to 90% relative humidity, without prolonged oil immersion.
The documented material identity and retention geometry do not replace a numerical interface strength result when specifying a minimum bond load.
4. How Overmolding Works
In the two-stage overmolding process, the rigid PC component is molded first, then positioned in a second cavity before molten TPE is introduced. The molten material fills the intended grip region, contacts the prepared substrate, passes through retention features where designed, then cools and is ejected. The part is checked for visible lift, filling defects and damage at the locks.
For this industrial grip, the case specifies a PC wall of 2.5 mm, a nominal TPE thickness of 2.0 mm and local transitions of 1.5 to 2.5 mm. TPE starting settings in the project are a 190 to 220 °C barrel window and a 35 to 50 °C mold window, with initial pack and cooling times of 6 s and 20 s. These are project settings to refine against the selected TPE subgrade and insert response, not general processing limits for all TPE materials.
The case lists PC predrying at 120 °C for 3 h as its preparation condition, with transfer control to limit moisture. Check insert distortion and edge quality while adjusting the second shot. rapid injection molding services connects the process review to tool design and production planning.
4.1 Two-Shot Molding vs Insert Molding
Two shot molding can refer to an integrated molding arrangement in which two polymers are injected within one coordinated production system. Insert overmolding can use a separately molded substrate loaded into a second tool. Both can produce multi-material parts, but part transfer, indexing, tooling cost, interface timing and production rate differ. The project case uses sequential molding with transfer of the PC insert; it should not be described as an automatically indexed two-barrel machine without additional process details.
5. Bonding, Adhesion and Mechanical Interlocks

Overmold retention has at least two distinct load paths. Chemical or physical adhesion acts along the material interface. Mechanical interlocks resist displacement through geometry: holes, undercuts, wraparound edges or captured ribs. A strong mechanical lock can carry a pull load while the exposed edge still peels. Inspect these failure paths separately.
5.1 Chemical Bonding and Surface Preparation
The surface must be suitable for the particular compound. Oil, silicone release agents, moisture, handling contamination and an excessively cold substrate can reduce repeatability. Surface activation or a primer may be useful for some materials, but introducing an added treatment changes both process control and qualification requirements.
ASTM D429-14(2023) defines methods for assessing rubber adhesion to rigid substrates under specified geometries and loading conditions. Its rubber-to-metal or otherwise defined specimen procedures must not be reported as direct standardized validation of any arbitrary PC/TPE interface. For plastic/TPE products, choose a representative part-level or agreed coupon procedure and report the actual load mode, dimensions, speed, environment and failure location.
5.2 Mechanical Interlock Design
The handheld grip case uses two through-holes at each end of each grip region, each 3.0 mm in diameter, with a minimum 3.0 mm edge distance. TPE passing through these openings creates retention features. The holes also concentrate stress in the PC, so the design must check cracks during cooling, demolding, assembly and use. The free ends of the elastomer should not form thin unsupported lips where peeling can start.
Mechanical interlocks change the load path but cannot ensure a continuous bonded seal. The production tooling and molds plan must provide sufficient steel support for shutoffs and the through-hole geometry.
6. Overmolding Design Guidelines
Keep the substrate securely located in the second mold without adding clamp loads that distort a thin shell. Specify the nominal overmold thickness and critical transitions, place gates away from exposed appearance edges where practical, and vent trapped air at fill ends. Inspect the overmold termination line for lift and the rigid substrate around every interlock for cracks.
Mismatch in shrinkage can lift an overmold edge or distort the insert. The manufacturing DFM design guidelines help identify thickness steps, gates, vents and shutoff conditions before cutting steel.
Do not take a universal minimum TPE thickness or fixed draft angle from a competitor chart and put it straight on a drawing. The appropriate value depends on grade flow, grip texture, mold release, demolding direction and the actual geometry.
7. Testing Overmolded Parts

Three different tests answer three different questions: how strongly the overmold is retained, how hard the elastomer surface is, and how much permanent deformation remains after compression. A product that passes one of these can fail another. Include actual-part inspection because standard material coupons may not capture stress at a free edge or lock.
| Method or check | What it measures | Important boundary |
| ASTM D429-14(2023) | Defined rubber-to-rigid-substrate adhesion configurations | Not a universal PC/TPE adhesion test |
| ASTM D2240-15(2021) | Indentation hardness using a stated durometer type | Thin curved overmold can be influenced by hard backing |
| ASTM D395-18(2025) | Compression set after specified exposure and recovery | Does not measure leak tightness or bond strength |
| Actual part inspection | Edge lift, cracks, retention and fit | Feature-specific checks must be agreed |
| Representative lap or peel coupon | Interface response under recorded fixture and speed | Do not compare different geometries as equivalent |
7.1 Adhesion and Failure Modes
The industrial grip project identifies five dedicated interface coupons, each with a 20 mm width and a 20 mm bonded overlap. The stated evaluation pulls a rigid PC end against a free TPE end at 50 mm/min and 23 ± 2 °C, with the fixture arranged to limit unintended peel loading. A load peak in newtons should be reported alongside whether failure occurred in the TPE, in the PC surface, at the interface, or through release of the mechanical lock.
The recorded case uses a dedicated lap configuration, not ASTM D429. Report its peak loads alongside the failure mode; the case table contains no numerical peak loads. Inspect edge lift, PC cracking and every retention hole separately.
7.2 Shore Hardness and Compression Set
The specified target for the grip is 60 ± 5 Shore A. The case identifies ISO 48-4:2018 testing on suitable flat, same-batch specimens at 23 ± 2 °C. This is distinct from ASTM D2240, which offers a different durometer method; neither standard makes a curved 2 mm bonded grip automatically equivalent to an appropriately supported reference specimen.
For compression set, the project lists ISO 815-1:2019 Method A with separately molded elastomer samples at 70 °C for 22 h, 25% compression and a 30 min recovery, with a specified target of no more than 35%. This is a project acceptance target, not a universal TPE specification. ASTM D395 uses its own defined specimens and calculation methods; a reported result must identify which standard and method were actually used.
The recorded exposure program specifies 70 °C for 168 h, 20 cycles from −10 to 50 °C, and water immersion at 23 °C for 24 h. Compare retention and edge condition after exposure; these conditions alone are not a durability result. Long-term deformation warrants a separate plastic creep assessment.
8. Defects and Troubleshooting
A visible lifted edge is not always a material chemistry failure. Short fill can prevent the elastomer from reaching a locking feature. Wet PC can contribute to molding defects, while excessive heating or residual stress may damage the insert. Investigate the failure location before changing the resin.
| Observed defect | Possible contributing factors | Useful next check |
| Edge peeling or delamination | Grade mismatch, contamination, low interface temperature | Confirm grades, inspect surface and run controlled retention test |
| Short shot in overmold | Restricted gate, poor venting, inadequate flow | Review fill pattern, gate and vent locations |
| Flash | Tool mismatch, pressure or clamping issue | Check parting faces and process window |
| Crack near interlock | Sharp edge, residual stress, hole geometry | Inspect PC around all holes after molding and load |
| Warpage or dimensional change | Cooling imbalance and differential shrinkage | Measure substrate and final part geometry |
| Surface streaks or bubbles | Moisture, entrapped gas or material handling | Inspect drying, transfer and venting |
Make changes one controlled factor at a time where possible. Otherwise an apparently improved grip may be the result of several simultaneous adjustments, leaving the production process difficult to reproduce.
9. Material Selection Checklist and RFQ
An RFQ that states only “PC with black TPE, 60A” leaves open the most important questions. Give the supplier a part function, actual rigid material grade, preferred elastomer chemistry, interface load case and inspection requirements. Ask for an explicit proposal when a soft grade must be substituted.
| RFQ or review field | What to specify |
| Rigid substrate | Commercial grade, reinforcement and critical surface condition |
| Overmold | Supplier grade, elastomer family, color and Shore scale |
| Function | Grip, cushioning, abrasion or sealing role and service exposure |
| Geometry | Thickness range, interface zone, lock dimensions and critical edges |
| Process | Insert handling, drying and controlled molding conditions |
| Verification | Interface test configuration, hardness method, inspection points and acceptance limits |
| Production transfer | First article, batch traceability and control of substitutions |
A low volume production services discussion should compare insert handling, second-shot tools, inspection effort and annual volume. The purchase specification must identify the required material pair and testing method.
Lock the material grades, mechanical retention geometry, processing window and inspection method in the purchase specification. Review each material substitution against the same part-level criteria.
10. Frequently Asked Questions
10.1 What materials can be overmolded?
Common substrates include PP, ABS, PC, PA and metal inserts. TPE, TPU, TPV and silicone systems are used as overmolds. Feasibility depends on the exact grades, interface retention design, tooling and service environment. Not every combination will bond without treatment or mechanical retention.
10.2 Can TPE bond to PP?
Certain TPE formulations are developed for PP bonding, but PP is a low surface energy substrate. Confirm the supplier’s exact pairing guidance and verify the product interface, particularly at a peel-loaded free edge.
10.3 Is TPU better than TPE for overmolding?
TPU is a family within TPE. Choose according to wear requirements, desired feel, chemical exposure, moisture conditions, substrate compatibility and the available molding process, not a blanket ranking.
10.4 What is the difference between overmolding and two shot molding?
Overmolding describes forming one material over a substrate. Two shot molding describes a production arrangement that molds two materials in coordinated shots. An insert can instead be molded separately and transferred into a second cavity.
10.5 Does Shore A hardness prove a good bond?
No. A durometer test characterizes indentation hardness under stated conditions. Adhesion and mechanical retention must be evaluated separately. Compression set is a different measure again and does not prove leak tightness.
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